MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year’s Symposium will feature 5 technical tracks, plus an Interactive Poster Session. This three day event will be focused on SiP/Design/Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology). Learn more.
There will be over eighty booths on the exhibition floor with companies from all segments of the microelectronics industry including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom. Register for a Free Exhibitor Hall Visitor pass.
New Product 705HF High Force
Stop by the MRSI’s Booth (#621) to learn about our latest product innovations. Learn more about our recently released 705HF High Force die bonder which is equipped with a heated bond head that can apply up to 500N of force during the bonding process while providing heating up to 400°C from the top.