MRSI ARTICLES
NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI
VPT Components and MRSI Systems jointly address manufacturing challenges – Al Russo (VP of Engineering), VPT Components, Irving Wang and Jon Medernach, MRSI Systems
NEW Top Interview with Compound Semiconductor China – Dr. Limin Zhou MRSI (Mycronic Group) 2022 (English)
Abstract: In this year’s Laser World of Photonics China(Shanghai), MRSI Systems continues to bring the most advanced 1.5 micron high-speed, high-precision, ultra-flexible automatic die bonder to provide on-site demonstration for domestic device manufacturers. The MRSI-H series die bonders are the industry’s proven solution for high-precision photonic production devices.
“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021
Assembly solution addresses TO-can photonic device manufacturing challenges
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
Die-bonder innovations target HPLD manufacturing challenges
A Die Bonding Solution for Packaging High-Power Laser Diode Chips and Bars (Chinese Version)
NEW HPLD製造の課題を解決する、革新的なダイボンダ (Japanese Version)
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Originally published in Chip Scale Review – July August 2017 Issue
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 Issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
High Precision Die Bonding for Photonics Packaging
Automating Hybrid Circuit Assembly
Automated Techniques Improve Microwave-Module Assembly
Next-generation Electronics Packaging Using Flip Chip Technology