MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support multi-die, multi-process production for RF power amplifiers for 5G base station applications, read an excerpt from Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems’ article “Automating RF PA device manufacturing to accelerate 5G wireless rollout” which was published in the March April 2021 issue of Chip Scale Review:
RF PA devices have two major die bonding assembly methods: eutectic and epoxy. The eutectic process, which is the most common die bonding technique for power electronic devices, has historically been the only method for making higher power RF PA devices used in base stations. The eutectic alloy between the die and the heat sink is typically gold-silicon (AuSi) or gold-tin (AuSn), which gives the best thermal conductivity and lowest possible void rate after bonding. On the other hand, the traditional epoxy process may be cheaper, but has lower thermal conductivity and a higher void rate after bonding. This may be sufficient for some low-power/low-reliability devices. In recent years, some new die bonding adhesive materials and processes have been developed to replace AuSi/AuSn solder for cost reduction for high-power devices. For example, the pressureless nanosilver sintering materials are expected to have good thermal conductivity for high-power devices and to be able to adapt the standard epoxy dispensing equipment and process.
There are five major challenges to achieving a good die bonding process using a fully-automated solution in order to enable multi-process and multi-die manufacturing required for RF PA device production for 5G base stations.
Read the full Chip Scale Review article.
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