Advanced Photonics Applications – MRSI-H-LD 

Advanced Photonics Applications – MRSI-H-LD 

Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. The system is capable of building...
LASER World of PHOTONICS CHINA 2020

LASER World of PHOTONICS CHINA 2020

LASER World of PHOTONICS CHINA 2020 MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be over 1,000 exhibitors representing the...
High-power Laser Diode Manufacturing Challenges

High-power Laser Diode Manufacturing Challenges

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:  Critical process challenges  The die bonding process is the most critical packaging step...