Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. The system is capable of building...
LASER World of PHOTONICS CHINA 2020 MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be over 1,000 exhibitors representing the...
This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges: Critical process challenges The die bonding process is the most critical packaging step...
MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for...
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020. Visit MRSI (Booth #6137) at the OFC Exhibition from March 10-12. OFC is the largest global conference and exposition for optical...
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top honors, and the MRSI-HVM series was awarded as one of the most competitive...