Exploring Automotive LiDAR Packaging Trends
In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels and distinctions between LiDAR and optical transceivers. Here is an...
Explore the Future of Photonics Industry with MRSI at CSC 2024 Conference
Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China. Dr. Limin Zhou, the General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic...
Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England
In the ever-evolving landscape of microelectronics, innovation is paramount. Positioned at the forefront of this technological revolution is MRSI and we are bringing tomorrow’s electronics to life through our assembly solutions. We will be presenting and exhibiting at...
The MRSI-H1 Family: Unleashing Precision and Agility
The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution. Here is why it captures attention: Superior Flexibility: The MRSI-H1 family is designed to handle true multi-die, multi-process, and multi-product scenarios....