INSIGHTS

Articles

NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI

CSR cover 12-2023

“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021

Assembly solution addresses TO-can photonic device manufacturing challenges

An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案

Flexible high-volume die bonding solution targets modern photonics manufacturing

The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案

High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors 

Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战

Laser Focus World

Challenges for photonics manufacturing in the new data center era

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Chip Scale Review

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)

Originally published in Chip Scale Review – July August 2017 Issue

Advanced Eutectic Packaging for Volume Manufacturing of Photonics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)

Originally published in Chip Scale Review – July August 2016 issue

适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

Blog

MRSI to present and attend 4th LiDAR Tech 2022

MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications of LIDAR technology. Dr. Limin Zhou’s presentation will focus on...

MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center. This year’s symposium will be centered upon “Packaging technologies enabling the new...

MRSI to exhibit at the European Microwave Week in Milan

MRSI to exhibit at the European Microwave Week in Milan

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in Milan, Italy with over 4,000 visitors from around the globe, 1,600...

MRSI Mycronic to Present at Automotive LIDAR 2022

MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and applications. The sessions provided will explain the approaches that...