INSIGHTS
Articles
NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI
“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021
Assembly solution addresses TO-can photonic device manufacturing challenges
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)
Originally published in Chip Scale Review – July August 2017 Issue
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
Blog
ECTC San Diego 2022 Highlights
The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth to talk with us. We look forward to seeing everyone next year at ECTC...
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts. The conference provides an opportunity to learn the current insights in...
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such as lasers, optical transceivers, RF power amplifiers, LiDAR, VR/AR and...
Come visit us at the International Microwave Symposium
Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer. This three-day event will provide several opportunities for us to demonstrate...
Visit MRSI at ECTC in San Diego
MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your manufacturing challenges. The conference includes technical and panel...