INSIGHTS

Articles

NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI

CSR cover 12-2023

“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021

Assembly solution addresses TO-can photonic device manufacturing challenges

An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案

Flexible high-volume die bonding solution targets modern photonics manufacturing

The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案

High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors 

Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战

Laser Focus World

Challenges for photonics manufacturing in the new data center era

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Chip Scale Review

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)

Originally published in Chip Scale Review – July August 2017 Issue

Advanced Eutectic Packaging for Volume Manufacturing of Photonics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)

Originally published in Chip Scale Review – July August 2016 issue

适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

Blog

ECTC San Diego 2022 Highlights

ECTC San Diego 2022 Highlights

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth to talk with us. We look forward to seeing everyone next year at ECTC...

Join MRSI at SEMICON West 2022

Join MRSI at SEMICON West 2022

We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such as lasers, optical transceivers, RF power amplifiers, LiDAR, VR/AR and...

Come visit us at the International Microwave Symposium

Come visit us at the International Microwave Symposium

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer. This three-day event will provide several opportunities for us to demonstrate...

Visit MRSI at ECTC in San Diego

Visit MRSI at ECTC in San Diego

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your manufacturing challenges. The conference includes technical and panel...