Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices. The flexible, configurable platform has a large working area, which is perfect for...
MRSI Air-Knife Needle Cleaning System
MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems. The accessory automatically cleans needles of built up epoxy during a production program. The system lowers the...
Learn more about MRSI’s Training Programs
MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the...
Visit MRSI at SEMICON West in San Francisco
SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA. The conference and exhibition bring together leaders in the industry to discuss the latest innovations, trends, and developments in the...