MRSI New Solution: Tape Holder
Image: Tape Holder with Tape and Waffle Pack If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips of tape material at a time....
Automotive LiDAR: Photonics assembly requirements and trends
MRSI’s latest article in the November/December 2023 issue of Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared. The photonics device assembly requirements and...
MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process. It is an ideal...
Advanced Packaging for Heterogeneous Integration
Image: MRSI-S-HVM 300mm wafer table with the wafer frame and an attached 300mm wafer Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes,...