INSIGHTS
Articles
NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI
“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021
Assembly solution addresses TO-can photonic device manufacturing challenges
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)
Originally published in Chip Scale Review – July August 2017 Issue
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
Blog
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During the conference, Infostone announced the 9th heroes company list in four categories: "The Most Competitive Products of Optical...
Experience MRSI’s latest innovations at the OFC Exhibition
Hybrid Conference - In-Person and Virtual Presentations Technical Conference: 05 - 09 March 2023 Exhibition: 07 - 09 March 2023 San Diego Convention Center, San Diego, California, USA MRSI will be a featured exhibitor at the OFC Exhibition. The OFC...
Improve pick and place machine utilization by keeping dies in their places
A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of pocket where dies migrate out of the pockets within the waffle pack. Migrated dies are often rotated and on top of each other, making it impossible for die...
Join MRSI at SPIE Photonics West in San Francisco
Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be sponsoring and attending SPIE Photonics West 2023. SPIE Photonics West offers you the chance to meet with our team, learn about our products, and get answers to all of your questions....
The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for...