INSIGHTS
Articles
Assembly solution addresses TO-can photonic device manufacturing challenges
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
Flexible high-volume die bonding solution targets modern photonics manufacturing
The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战
Challenges for photonics manufacturing in the new data center era
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)
Originally published in Chip Scale Review – July August 2017 Issue
Advanced Eutectic Packaging for Volume Manufacturing of Photonics
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 issue
适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Assembly
Blog
Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices. The flexible, configurable platform has a large working area, which is perfect for...
MRSI Air-Knife Needle Cleaning System
MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems. The accessory automatically cleans needles of built up epoxy during a production program. The system lowers the...
Learn more about MRSI’s Training Programs
MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the...
Visit MRSI at SEMICON West in San Francisco
SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA. The conference and exhibition bring together leaders in the industry to discuss the latest innovations, trends, and developments in the...
MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos
MRSI will exhibit at LASER World of PHOTONICS CHINA from July 11-13, 2023 in Hall 7, Booth #7.1B141 of the National Exhibition and Convention Center (Shanghai), in Shanghai, China. At China’s leading photonics exhibition there will be over 1,000 exhibitors...