INSIGHTS

Articles

NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI

CSR cover 12-2023

“Automating RF PA Device Manufacturing”, as seen in Chip Scale Review March/April 2021

Assembly solution addresses TO-can photonic device manufacturing challenges

An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案

Flexible high-volume die bonding solution targets modern photonics manufacturing

The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing (Chinese Version)
为现代光子制造提供最精确的灵活量产芯片贴片解决方案

High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors 

Challenges of photonics manufacturing in new data era (Chinese Version)
新数据中心时代光电制造领域面临的挑战

Laser Focus World

Challenges for photonics manufacturing in the new data center era

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Chip Scale Review

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)

Originally published in Chip Scale Review – July August 2017 Issue

Advanced Eutectic Packaging for Volume Manufacturing of Photonics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)

Originally published in Chip Scale Review – July August 2016 issue

适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

Blog

MRSI Air-Knife Needle Cleaning System

MRSI Air-Knife Needle Cleaning System

MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems. The accessory automatically cleans needles of built up epoxy during a production program. The system lowers the...

Learn more about MRSI’s Training Programs

Learn more about MRSI’s Training Programs

MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the...

Visit MRSI at SEMICON West in San Francisco

Visit MRSI at SEMICON West in San Francisco

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA. The conference and exhibition bring together leaders in the industry to discuss the latest innovations, trends, and developments in the...

Watch MRSI’s Software Training Videos

Watch MRSI’s Software Training Videos

MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These videos cover a wide range of topics and are suitable for both beginners and advanced users. All ten videos are available...