MRSI BLOG
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from...
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
By fiber.ofweek.com The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging industry for global optoelectronics, MRSI Systems has...
MRSI Systems Vice President of Sales – Dan Crowley
Mr. Crowley has over 35 years of capital equipment technical sales and marketing experience in the semiconductor and electronic packaging market specializing in dispense, assembly and test. He is currently serving in the position of Vice President of Sales at MRSI...
Thank You for Visiting MRSI at the International Microwave Symposium in Boston
The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over last year. Thank you to everyone that visited MRSI at the International...
Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
Dr. Limin Zhou, Senior Director Strategic Marketing, MRSI Systems Rapid Growth of LiDAR Market LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images,...
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the Mycronic Demonstration Center in the Luchuang Yungu Building, Nanshan...
Join MRSI Systems at SEMICON West 2019
MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center. Visit MRSI Systems at SEMICON West and we will discuss how our die bonding and epoxy dispensing solutions may fulfill your needs for R&D, pilot...
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end markets in Telecom/Datacom, Aerospace & Defense, Medical Devices,...
MRSI Systems配备HVM3芯片贴装演示中心在深圳南山开放 欢迎参观
ICCSZ讯 近日，全自动，高速，高精度，灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下，讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。...
MRSI Presented at IMAPS New England – Automated Solutions for High Power Laser Diode Packaging
MRSI Systems exhibited and presented a technical paper at the IMAPS New England Symposium and Expo this month. The event included more than 60 exhibitors, over 30 technical papers as well as 18 poster papers from several universities. This regional Symposium included...
International Microwave Symposium 2019
MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the Boston Convention Center from June 2-7, 2019. The symposium includes technical and panel sessions about the latest insights...
MRSI Systems World Class Customer Support – Jack Inocencio
Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated an impressive set of skills covering process and application engineering...
Optoelectronics Packaging
MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies required to successfully produce photonic integrated circuits. In recent...
MRSI Systems is Presenting at IMAPS New England 46th Symposium and Expo
IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 7th, 2019. This year’s Symposium theme is “Connectivity Rocks." The keynote speaker Gerald Charlwood, Director Lightwave Antenna Business Unit – MACOM will...
Visit MRSI Systems at SEMICON China 2019 in Shanghai
MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567. SEMICON China is the world’s largest Microelectronics Exhibition for the...
Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing
Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps strengthen the relationship with current key accounts, given his extensive...
Great Week at SPIE Photonics West 2019
Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with over 20,000 people including over 1,300 companies. The technical conference...
MRSI Global Customer Support – Jason Liu
Joining MRSI in 2016 as a Customer Support Engineer with over 20 years of experience with MRSI’s machines and applications experience, Jason was ready to assist customers from Day 1. Deep Practical Experience Customers of MRSI want to connect with a customer support...
Visit MRSI Systems at the Optical Fiber Conference in San Diego
Visit MRSI Systems at the Optical Fiber Conference in San Diego The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541 at OFC...
MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions
Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver industry-leading speed without sacrificing flexibility, precision or reliability. These...
MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019
MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019. MRSI is proud to sponsor SPIE Photonics West this year because it is the premier conference and exhibition for the industries MRSI...
Mycronic’s Capital Markets Day in Stockholm on November 29
Over 60 institutional investors, equity analysts and media representatives attended Mycronic's Capital Markets Day on November 29 at IVA Conference Center, Greve Turegatan 16, in Stockholm, with a further 120 viewing the webcast. These are large numbers for a company...
MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums
MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including other industry peers from MACOM and Viavi Solutions. The panel discussed the...
Automotive LIDAR Conference 2018: AI & Autonomous Vehicles
LIDAR (LIght Detection and Ranging) is a ranging and positioning system that measures distance to a target by illuminating the target with pulsed laser light and measuring the reflected pulses with a sensor. Differences in laser return times and wavelengths can then...
Highlights of the Microelectronics Symposium
The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic packaging technologies. The event was well attended with 1,000 participants...
Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing
This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems. Challenge The optical communications industry is facing a generational change to its supply...
Photonics Manufacturing for the Hyperscale Data Center Era
Datacom Challenges This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond: As data center demand becomes the new growth engine, the...
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center. There will be over 100 booths on the exhibition floor from October 9-10, 2018, with companies from all...
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders
MRSI Systems is exhibiting at ECOC in Rome, Italy, September 24-26, 2018 at the Fiera Roma, The Exhibition & Congress Centre of Rome. ECOC is the largest optical communications event in Europe. In 2017, there were 327 companies and over 5,900 visitors from 81...
Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform
The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of photonics manufacturing – To illustrate our understanding of an automation...
MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen,...
Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics manufacturing, which requires flexible, high speed, and high precision automation to...
IMS 2019 Boston
The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400 participants including over 4,500 attendees and 4,000 exhibitors with 36% new attendees from over 50 countries....
Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
MRSI recently launched an extensive library of software training videos for your MRSI die bonders and epoxy dispensers. These videos are the perfect tool for training new operators of MRSI die bonders and as a refresher course for existing users. These cost-effective...
SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an enormous generational challenge. Driven by the huge growth of internet...
How to Choose an Epoxy Dispenser
When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and dependability and ideally be recognized by the market as the industry...
Epoxy Die Bonding of Ultra Small Ceramic Capacitors
MRSI-705 Equipped with New High Precision Tape Feeders for Very Small Parts Challenge As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller...
International Microwave Symposium 2018
MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018. The symposium includes technical and panel sessions about the latest insights such as High...
Building Complex Hybrid Circuits-Advanced Packaging
Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically geared to these challenging applications. MRSI-705 5 Micron Die Bonder...
International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo
IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018. The theme of this year’s Symposium is “Into the Future Autonomously.” The keynote speaker Chris Jacobs, Vice President, Analog Devices will present...
Die Bonding Process Pages – Highlights
Last quarter, we published some of the key processes that our fully automated die bonding systems are able to perform. Below we share some extracts from the three key sections: Die Bonding Eutectic Die Bonding Epoxy Die Bonding Die Bonding can thereby be succinctly...
MRSI Systems Launches New Software Video Training Programs
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems. These videos are the perfect tool for training new operators of MRSI machines and as a refresher course for existing users. These cost-effective...
Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications
There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high volume manufacturing of photonic devices. The following post highlights...
Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The Optical Fiber Conference will be held at the San Diego Conference Center in San Diego, CA, USA from March 11th-March 15th, 2018. The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. OFC is the largest global conference and...
MRSI Systems’ Customer Support – Peter Cronin
Peter Cronin joined MRSI Systems in 2000 in time to see MRSI produce record results in 2001. Peter started at MRSI as a Sales Engineer, providing sales support, demos, and product advice. Over years of supporting the product family, Peter began growing the...
MRSI Systems Supports “Advancing Innovation in Photonics”
Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics ecosystem. AIM Academy launched its premiere Lab for Education & Application Prototypes (LEAP) on MIT's campus in the spring of 2017. On...
MRSI Systems—New Process Pages
MRSI Systems has published a set of Process Pages to help explain the world of Die Bonding, how it fits into advanced packaging within the semiconductor supply chain and MRSI’s expertise in advanced packaging and the history of these various processes. Our new pages...
MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
Internet traffic has been growing at an exponential level, continuously driven by video streaming, 3D imaging, IoT, VR/AR, and other emerging data applications. The data generated by internet traffic is enormous and data centers are crucial to support data...
MRSI Systems is Exhibiting at SPIE Photonics West
MRSI Systems is Exhibiting at SPIE Photonics West MRSI Systems will be exhibiting at SPIE Photonics West. SPIE Photonics West will be held at the Moscone Center in San Francisco, CA, USA from January 27-February 1, 2018. This is the flagship event for companies in the...
Die Bonding Solutions
Key Elements in Achieving Accurate Local and Global Alignments Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement. In addition,...
Fully Automated Die Bonding Systems — The Importance of Proper Lighting
Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of "one size fits all." The proper illumination of a given surface type requires flexibility in lighting. Variations in devices from vendor to vendor or...
MRSI Systems’ Sales Team – Jon Medernach
Experience Jon Medernach manages Sales in the Eastern Region and has over 15 years of experience at MRSI and 34 years’ experience selling capital equipment. Prior to MRSI, Jon worked with Panasonic Factory Automation selling high speed surface mount assembly equipment...
High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial to meet this demand, particularly fueled by hyperscale data centers. Further integration of photonics and electronics...
Visit MRSI Systems at Productronica 2017 in Munich, Germany
Productronica is the world’s leading international trade fair for innovative electronics production. The 41st Productronica trade fair will be held in Munich, Germany at Messe München, November 14-17, 2017. MRSI Systems a leading manufacturer of fully automated,...
Challenges and Solutions in the Photonics Packaging Industry
A recent article in Chip Scale Review “Automotive LiDAR: Photonics assembly requirements and trends” discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers. The photonics device assembly requirements...
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017 in Raleigh, North Carolina. MRSI Systems will be exhibiting - Booth #234. There will be over 120 booths on the show room floor from October 10-11, 2017, with companies from all...
High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)
In this post we examine the critical manufacturing challenges facing Photonic Device manufacturers as they scale up to meet unprecedented demand. Specifically, we explain the issues surrounding CoS and how die bonders have evolved to meet the new demands of the...
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
MRSI Systems is exhibiting at ECOC in Gothenburg Sweden, September 18-20, 2017. ECOC is the largest optical communications event in Europe at the Svenska Massan, the Swedish Exhibition and Congress Centre. Last year there were 313 companies and over 5,000...
China International Optoelectronic Expo – September 2017
MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 completing chip-on-carrier (CoC) eutectic and epoxy bonding....
Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)
Most die bonders offered today have evolved from their original objective of solving generic semiconductor packaging applications. While these semiconductor die bonders may be well-suited for the die bonding requirements of semiconductor packages, they lack the...
2017 International Microwave Symposium Highlights
Over 450 exhibiting companies and 8,000 participants came from around the world, covering a range of industry segments, from materials, devices, components, and subsystems, as well as design and simulation software and equipment. Microwave Theory and Techniques...
MRSI Participated in the 2017 Electronic Components and Technology Conference(ECTC)
There were 106 exhibitors and 1,439 attendees from 22 countries at the conference. Sponsors included Amkor, Cadence, Deca Technologies, Dow Electronic Materials, Lintec, Nanium, Applied Materials, IBM, and Zeiss. Babak Sabi, Corporate Vice President and Director of...
Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster
Challenge The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels. This expansion, with double-digit growth rates, is driven by data consumption from cloud...
Automated Die Bonding for High Volume Optoelectronics Packaging
MRSI Systems exhibited at iMAPS NE in May. Dr. Yi Qian, our VP of Product Management organized and chaired a technical session on “Nanoelectronics and Optoelectronics.” The topics were quite broad from silicon photonics to sensors, high power diode lasers, PV, and...
MRSI Systems Customer Support Team – Ezer Espares
Experience Ezer Espares has over 25 years of experience in semiconductor packaging, surface mount technology, testing, and equipment support, including installations and customer support. Ezer was originally a representative for MRSI Systems in the Philippines and...
4 Recent Topics in Advanced Packaging
Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging and ask why now, what problem is the new technology solving, and finally what are the implications. Advanced...
International Microwave Symposium 2017
MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017. The symposium includes technical and panel sessions about the latest insights in mm-wave applications, 5G, IoT, and Advanced...
ECTC – The 67th Electronic Components and Technology Conference
MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry. The conference includes technical and panel sessions about the latest insights in advanced packaging, optoelectronics, high-speed, wireless & components, and...
MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge
In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting. The theme for this year’s spring meeting was STATUS 2017 AND STRATEGIES FOR 2025 - THE INTEGRATED PHOTONICS...
2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and friends, showcase our solutions, and learn new things that are centered around our historical strengths in photonics and optoelectronics packaging solutions. Thank...
iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”
The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017. The keynote address - “From Interconnect to Innovation in the DoD” will be presented by Dr. Livia Racz from MIT Lincoln...
Hybrid Electronics Technology for Printed Lighting
Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam Scotch—“Challenges of Integrating Printed Electronics into the Lighting Industry.” MRSI Systems has been a long-time supporter of iMAPS....
What is the Future of Optoelectronics Packaging?
Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone and all machines. In this post, we will explain how 5G implementation will enable new advances and challenges in the...
How to Choose a Die Bonding System
Challenge Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems with in-situ capabilities, such as epoxy die attach, eutectic die bonding, and thermo-compression. This post describes the key...
Technology Students Experience Local Advanced Technology Manufacturer Up Close
Middlesex Community College technology students recently visited our factory in Billerica, MA. Peter Cronin, Director of Applications and Service taught the students about our MRSI-M3 3-micron die bonder. These students were interested in visiting MRSI to learn more...
Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
Challenge TESAT’s challenge was to develop an “Automated Microwave Factory" to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift. TESAT wanted a high volume,...
Join MRSI Systems at OFC!
MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI's product offerings of epoxy and eutectic die bonders by visiting us at the show. From...
MRSI Systems’ Exceptional Customer Support
After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being trained in your system who can quickly deal with your issue? The customer support process begins the moment we receive your call or...
Challenges in Die Bonding of Gallium Nitride High Power Devices
The gallium nitride (GaN) device market is rising at a compound annual growth rate of (CAGR) of 17.1% according to Mordor Intelligence, implying a rise from $711m to $1.8 billion by 2023. Gallium Nitride (GaN) materials have long been regarded as great alternatives...
How Does MRSI Systems Manufacture to Customer’s Specification?
Acting Like an Owner MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an owner ensures pinpoint focus on creating value for...
Multiple Die Eutectic Bonding
Table 1. Different metal compositions have specific reflow profiles for eutectic die bonding. An introduction to Successful Applications The word “eutectic” originated from the Greek word eutektos that means, “easily melting.” In chemistry, eutectic means relating to...
High Volume Manufacturing of Photonic Components and Modules
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates is driven by increased data consumption. The data bandwidth demand from individual consumers and enterprises creates...
MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting
MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting On November 2, 2016, MRSI Systems participated in the Commercial and Business...
MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable (AOC) into the MRSI-M3 Ultra Precision Assembly Work Cell. The overall...